Tag Archives: Molded Interconnect Devices

CES 2017: China Dominates Molding

More than 200,000 people are expected to pack into Las Vegas this week to attend the 50th Consumer Electronics Show, now called just CES. It’s become a must-attend [..]

Electronics, North America ,

3D Electronics Debut in Sensor Application; Lighting Is Next

Applications for the Laser Direct Structuring Process (LDS) are growing as major resin producers put muscle into the technology. In a new example, 2E mechatronic GmbH & Co. [..]

Conductive Material, Consumer Goods, Design, Electronics, Engineering Thermoplastics, Europe, Industrial, Injection Molding, Laser Structuring , , , ,

LNP Develops Colorable Compound for Molded Electronic Devices

More materials’ companies are coming onboard with materials developed for the Laser Direct Structuring process. The result will be continued penetration of the technology into three-dimensional electronic components. [..]

Design, Electronics, Engineering Thermoplastics, Injection Molding, Laser Structuring, North America, Telecommunications , , ,