Tag Archives: LPKF

3D Electronics Debut in Sensor Application; Lighting Is Next

Posted on January 25, 2012 by Doug Smock | Permalink 0

Applications for the Laser Direct Structuring Process (LDS) are growing as major resin producers put muscle into the technology. In a new example, 2E mechatronic GmbH & Co. [..]

Conductive Material, Consumer Goods, Design, Electronics, Engineering Thermoplastics, Europe, Industrial, Injection Molding, Laser Structuring , , , ,

LNP Develops Colorable Compound for Molded Electronic Devices

Posted on October 14, 2011 by Doug Smock | Permalink 0

More materials’ companies are coming onboard with materials developed for the Laser Direct Structuring process. The result will be continued penetration of the technology into three-dimensional electronic components. [..]

Design, Electronics, Engineering Thermoplastics, Injection Molding, Laser Structuring, North America, Telecommunications , , ,