Category Archives: Laser Structuring

Invention Targets Mechanical Weakness of Molded-In Antennas

Mitsubishi Engineering-Plastics Corp., Tokyo, says it has developed a superior compound for making three-dimensional antennas in cellphones. The glass-reinforced alloy of polycarbonate and ABS contains as much as [..]

ABS, Asia, Electronics, Filler, Injection Molding, Laser Structuring, Polycarbonate, Polystyrene, Reinforcing Material , , ,

LPKF Fights Patent Infringement On LDS Process

On July 8, the Mannheim Regional Court in Germany ordered Motorola Deutschland and Motorola Mobility USA to refrain from selling cell phones in Germany that infringe on LPKF’s [..]

Asia, Conductive Material, Design, Electronics, Engineering Thermoplastics, Europe, Injection Molding, Laser Structuring, Micro Molding , ,

3D Electronics Debut in Sensor Application; Lighting Is Next

Applications for the Laser Direct Structuring Process (LDS) are growing as major resin producers put muscle into the technology. In a new example, 2E mechatronic GmbH & Co. [..]

Conductive Material, Consumer Goods, Design, Electronics, Engineering Thermoplastics, Europe, Industrial, Injection Molding, Laser Structuring , , , ,

LNP Develops Colorable Compound for Molded Electronic Devices

More materials’ companies are coming onboard with materials developed for the Laser Direct Structuring process. The result will be continued penetration of the technology into three-dimensional electronic components. [..]

Design, Electronics, Engineering Thermoplastics, Injection Molding, Laser Structuring, North America, Telecommunications , , ,