A new engineering plastic from Celanese is advancing the potential for overmolding of RFID tags.
Fortron ICE polyphenylene sulfide (PPS) enables full crystallinity at lower temperatures while maintaining PPS high-performance characteristics for chemical and thermal resistance, high hardness, rigidity and dimensional stability, and low creep and moisture absorption. Tensile bars molded at 90ºC mold temperature from the new engineering plastic show similar physical properties as those molded at the standard 135ºC mold temperature.
As a result, sensitive electronics in RFIDs can survive the molding process. Most are now assembled out of the mold via sonic welding or other processes. Since injection molded parts can reach the full crystalline stage faster, there is also less warpage, according to Celanese scientist Ke Feng, who presented technical details on the resin at ANTEC 2014 last month in Las Vegas, Nevada.
A small spinoff from Cascade Engineering announced last month that it is now manufacturing one-piece, fully encapsulated RFID tags– the Allied Series VX-MidTM HT—using the new PPS, which was officially introduced at last year’s K Fair in Germany. Complex parts such as pump covers are also seen as good candidates for the new technology.